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Acknowledgements Toshiba Machine Co Ltd Tokyo, Japan, for their exhibits, catalogues, and specimens produced on their ultra-precision turning and grinding machines, and for providing the details of their machine (ULG-100A-H) at the National University of Singapore My special thanks go to Mr Takeshi Momochi of Toshiba for the many personal discussions we had on their machines and products in Bangkok, Malaysia and Singapore Prof Noel MacDonald of Cornell University for sending the slides of his presentation on MEMS at the ASPE meeting in Rochester in 1998, and also for his relevant notes Intel Malaysia for their generous research grant for Failure analysis studies of their Pentium III chip which resulted in two inventions that figure in the book and in many publications

9.1 9.2 9.3 9.4 9.5 Introduction / 9.1 Methods of Increasing Circuit Density / 9.2 Copper foil / 9.2 Laminate Constructions / 9.7 Prepreg Options and Yield-Per-Ply Values / 9.9

9.6 Dimensional Stability / 9.10 9.7 High-Density Interconnect/Microvia Materials / 9.13 9.8 CAF Growth / 9.15 9.9 Electrical Performance / 9.22 References / 9.33

10.1 Introduction / 10.1 10.2 RoHS Basics / 10.1 10.3 Base Material Compatibility Issues / 10.2 10.4 The Impact of Lead-Free Assembly on Base Material Components / 10.4 10.5 Critical Base Material Properties / 10.4 10.6 Impact on Printed Circuit Reliability and Material Selection / 10.18 10.7 Summary / 10.21 References / 10.22

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11.1 Introduction / 11.1 11.2 Pcb fabrication and Assembly Interactions / 11.1 11.3 Selecting the Right Base Material for Specific Application / 11.6 11.4 Example Application of this Tool / 11.14 11.5 Discussion of the Range of Peak Temperatures for Lead-Free Assembly / 11.15 11.6 Lead-Free Applications and Ipc-4101 Specification Sheets / 11.15 11.7 Additional Base material Options for Lead-Free Applications / 11.16 11.8 Summary / 11.17 References / 11.18

3.1 Introduction 21 3.2 AVR Family Architecture 22 3.3 The Register File 25 3.4 The ALU 26 3.5 Memory Access and Instruction Execution 3.6 I/O Memory 27

Information and pictures from books, journals, conference papers and internet sources are gratefully acknowledged in the form of citations that are referenced in the text, at the end of each chapter, and in an exhaustive consolidated author index at the end of the book A subject index is also provided I would like to thank my young co-author A/Prof Dr S Izman, who was my Ph D student, for the help in getting this book going, especially in the grinding area My thanks to Tang, my Master s student and research assistant for helping me in chapters 5 8 and for the many hours he spent with the whole book My thanks also goes to Parag Vichare (now at the University of Bath, UK) and Murugan, both Master s students, to Ahmad Kamely and Thet Thet Mon, Ph D students and Calvin Woo, research assistant for their contribution to chapters 1 4 My heartfelt thanks to the McGraw-Hill (Education) team for their patience, guidance, enthusiastic help and the many suggestions that improved the manuscript Finally, my sincere and grateful thanks to my wife Gita, who withstood my absence from home gracefully and encouraged and prodded me in preparing the manuscript This help on the home front is always vital and I dedicate this book to her in particular and other members of the family PROF VC VENKATESH

12.1 12.2 12.3 12.4 12.5 12.6 12.7 Introduction / 12.1 Industry Standards / 12.2 Laminate Test Strategy / 12.4 Initial Tests / 12.5 Full Material Characterization / 12.9 Characterization Test Plan / 12.22 Manufacturability in the Shop / 12.23

13.1 13.2 13.3 13.4 13.5 13.6 13.7 Classes of PCB Designs / 13.3 Types of PCBs or Packages for Electronic Circuits / 13.9 Methods of Attaching Components / 13.14 Component Package Types / 13.15 Materials Choices / 13.18 Fabrication Methods / 13.22 Choosing a Package Type and Fabrication Vendor / 13.24

14.1 Objective of the PCB Design Process / 14.1 14.2 Design Processes / 14.1

Never has there been such a sweeping change in electronics manufacturing as imparted by WEEE and RoHS particularly the latter. Every industry is being impacted either by processes and materials or materials availability.

High-precision CNC diamond turning machines are available for diamond mirror machining of components such as [3]: (a) Computer magnetic memory disc substrates (b) Convex mirrors for high output carbon dioxide laser resonators (c) Spherical bearing surfaces made of beryllium, copper, etc (d) Infrared lenses made of germanium for thermal imaging systems (e) Scanners for laser printers (f) X-ray mirror substrates Both lapping and polishing are considered to be high-precision machining operations Although the grinding of an IC silicon die discussed earlier falls under Taniguchi s second class of machiningprecision machining, the machining of the PCB of the IC after completely removing the silicon die substrate essentially falls under high-precision machining This operation tends to expose the transistors in the layers of the PCB Figure 119 depicts a typical high-precision machined PCB in which transistors in a layer are exposed Polishing of hard and brittle materials such as silicon wafers on a three-axis polishing machine, as shown in Figure 120 (a), has been reported [16] An LP600 precision Lapping and Polishing Machine (Figure 120 (b)) is found to be ideal for compound semiconductor wafer backthinning, ceramic substrate lapping, silicon wafer back thinning and sapphire wafer back thinning

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